Suresh K.
Senior Embedded Hardware Specialist
Designing a schematic is only half the battle. When transitioning to 4-layer or 6-layer high-speed PCB layout, signal integrity and manufacturability become critical.
Mistake 1: Fragmented return paths crossing split ground planes cause EMI emissions and signal degradation.
Mistake 2: Missing decoupling capacitor placement close to IC power pins increases switching noise.
Mistake 3: Inadequate thermal relief pads causing cold solder joints during reflow.
Mistake 4: Via-in-pad without proper filling on BGA or QFN components pulls solder away during reflow.
By adhering to strict DFM (Design for Manufacturing) guidelines, engineers avoid costly board respins and delivery delays.